Dropwise-filmwise coexisting condensation heat transfer.

Recurrent filmwise and dropwise condensation on a beetle mimetic surface.

Vapor condensation plays a key role in a wide range of industrial applications including power generation, thermal management, water harvesting and desalination. Fast droplet nucleation and efficient droplet departure as well as low interfacial thermal resistance are important factors that determine the thermal performances of condensation; however, these properties have conflicting requirement...

Condensate Drop Movement by Surface Temperature Gradient on Heat Transfer Surface in Marangoni Dropwise Condensation

Dropwise condensation heat transfer process optimisation on superhydrophobic surfaces using a multi-disciplinary approach

Dropwise condensation has superior heat transfer efficiency than filmwise condensation; however condensate evacuation from the surface still remains a significant technological challenge. The process of droplets jumping, against adhesive forces, from a solid surface upon coalescence has been studied using both experimental and Computational Fluid Dynamics (CFD) analysis. Both Lattice Boltzmann ...

Scalable graphene coatings for enhanced condensation heat transfer.

Water vapor condensation is commonly observed in nature and routinely used as an effective means of transferring heat with dropwise condensation on nonwetting surfaces exhibiting heat transfer improvement compared to filmwise condensation on wetting surfaces. However, state-of-the-art techniques to promote dropwise condensation rely on functional hydrophobic coatings that either have challenges...

Stable dropwise condensation for enhancing heat transfer via the initiated chemical vapor deposition (iCVD) of grafted polymer films.

Ultra-thin copolymer films are deposited by initiated chemical deposition (iCVD) to investigate their performance under the condensation of water vapor. By forming a grafted interface between the coating and the substrate, the films exhibit stable dropwise condensation even when subjected to 100 °C steam. The applicability of the iCVD to complex substrate geometries is demonstrated on a copper ...